| 发明名称 |
IMAGE SENSOR CHIP SIDEWALL INTERCONNECTION |
| 摘要 |
An image sensor chip having a sidewall interconnect structure to bond and/or electrically couple the image sensor chip to a package substrate is provided. The image sensor chip includes a substrate supporting an integrated circuit (IC) configured to sense incident light. The sidewall interconnect structure is arranged along a sidewall of the substrate and electrically coupled with the IC. A method for manufacturing the image sensor chip and an image sensor package including the image sensor chip are also provided. |
| 申请公布号 |
US2016163755(A1) |
申请公布日期 |
2016.06.09 |
| 申请号 |
US201414564231 |
申请日期 |
2014.12.09 |
| 申请人 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
发明人 |
Huang Kuo-Chin;Chen Pao-Tung;Chiang Wei-Chieh;Hashimoto Kazuaki;Liu Jen-Cheng |
| 分类号 |
H01L27/146 |
主分类号 |
H01L27/146 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An image sensor chip comprising:
a substrate supporting an integrated circuit (IC) configured to sense incident light; and a sidewall interconnect structure arranged along a sidewall of the substrate and electrically coupled with the IC. |
| 地址 |
Hsin-Chu TW |
