| 发明名称 |
Packaging Devices and Methods for Semiconductor Devices |
| 摘要 |
Packaging devices and methods for semiconductor devices are disclosed. In some embodiments, a packaging device for a semiconductor device includes a packaging substrate including a semiconductor device mounting region. The packaging device includes a stress isolation structure (SIS) disposed on the packaging substrate proximate a portion of a perimeter of the semiconductor device mounting region. |
| 申请公布号 |
US2016163657(A1) |
申请公布日期 |
2016.06.09 |
| 申请号 |
US201615041919 |
申请日期 |
2016.02.11 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Hung Wensen |
| 分类号 |
H01L23/00;H01L21/48;H01L23/367;H01L25/065;H01L23/053;H01L21/56;H01L25/00 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of packaging a semiconductor device, the method comprising:
placing a stress isolation structure (SIS) onto a packaging substrate proximate a perimeter of a semiconductor device mounting region of the packaging substrate; coupling a semiconductor device onto the semiconductor device mounting region of the packaging substrate; and adhering at least a first portion of the SIS to the packaging substrate using an underfill material. |
| 地址 |
Hsin-Chu TW |
