CHIP CARRIER WITH DUAL-SIDED CHIP ACCESS AND A METHOD FOR TESTING A CHIP USING THE CHIP CARRIER

摘要

Disclosed are chip carriers and methods of using them. The chip carriers each comprise a base with a first surface, a second surface opposite the first surface, and wire bond pads on the first and second surfaces. The first surface also has a chip attach area with opening(s) that extends from the first surface to the second surface. A chip can be attached to the chip attach area and, because of the opening(s), wire bond pads on opposite sides (e.g., on the top and bottom) of the chip are accessible for testing. That is, wire bond pads on the first surface can be electrically connected to one side of the chip (e.g., to the top of the chip) and/or wire bond pads on the second surface can be electrically connected through the opening(s) to the opposite side of the chip (e.g., to the bottom of the chip).

主权项

1. A chip carrier comprising:
a base having a first surface and a second surface opposite said first surface, said first surface having a chip attach area and said chip attach area having at least one opening that extends from said first surface to said second surface; and, multiple wire bond pads comprising first wire bond pads on said first surface and second wire bond pads on said second surface, said chip attach area supporting a chip so as to allow any of said first wire bond pads to be electrically connected to a first side of said chip and so as to allow any of said second wire bond pads to be electrically connected to a second side of said chip through said at least one opening.