SYSTEM, METHOD AND APPARATUS FOR LEADLESS SURFACE MOUNTED SEMICONDUCTOR PACKAGE

摘要

A packaged semiconductor device may include a termination surface having terminations configured as leadless interconnects to be surface mounted to a printed circuit board. A first flange has a first surface and a second surface. The first surface provides a first one of the terminations, and the second surface is opposite to the first surface. A second flange also has a first surface and a second surface, with the first surface providing a second one of the terminations, and the second surface is opposite to the first surface. A die is mounted to the second surface of the first flange with a material having a melting point in excess of 240° C. An electrical interconnect extends between the die and the second surface of the second flange opposite the termination surface, such that the electrical interconnect, first flange and second flange are substantially housed within a body.

主权项

1. A packaged semiconductor die (SD), comprising:
a termination surface comprising a plurality of terminations configured as leadless interconnects to be surface mounted to a circuit board; a first flange having a first surface of the first flange and a second surface of the first flange, the first surface of the first flange providing a first one of the plurality of terminations, wherein the second surface of the first flange is opposite to the first surface of the first flange; a second flange having a first surface of the second flange and a second surface of the second flange, the first surface of the second flange providing a second one of the plurality of terminations, wherein the second surface of the second flange is opposite to the first surface of the second flange; a die metallurgically attached to the second surface of the first flange with a Pb-free, die attach material having a melting point in excess of 240° C.; and an electrical interconnect between the die and the second surface of the second flange opposite the termination surface, wherein the electrical interconnect, the first flange and the second flange are substantially housed within a body.