SINGLE-LAYER WIRING PACKAGE SUBSTRATE, SINGLE-LAYER WIRING PACKAGE STRUCTURE HAVING THE PACKAGE SUBSTRATE, AND METHOD OF FABRICATING THE SAME

摘要

A single-layer wiring package substrate and a method of fabricating the same are provided, the method including: forming on a carrier a wiring layer having a first surface and a second surface opposing the first surface and being in contact with the carrier; forming on the carrier and on the wiring layer a dielectric body that has a first side having a first opening, from which a portion of the wiring layer is exposed, and a second side opposing the first side and disposed at the same side as the second surface of the wiring layer; and removing the carrier, with the second side of the dielectric body and the second surface of the wiring layer exposed. Therefore, a coreless package substrate is fabricated, and the overall thickness and cost of the substrate are reduced.

主权项

1. A method of fabricating a single-layer wiring package substrate, comprising:
forming a wiring layer having opposing first and second surfaces on a carrier, wherein the second surface of the wiring layer is in contact with the carrier; forming a dielectric body on the carrier, wherein the dielectric body has a first side and a second side opposing the first side, and the second side of the dielectric body and the second surface of the wiring layer are disposed at a same side; forming a first opening on the first side of the dielectric body with a portion of the wiring layer exposed from the first opening; and removing the carrier with the second side of the dielectric body and the second surface of the wiring layer exposed.