SUBSTRATE SURFACE METALLIZATION METHOD AND SUBSTRATE HAVING METALLIZED SURFACE MANUFACTURED BY THE SAME

摘要

A coating device for coating a coating liquid onto a substrate includes: a coating head having a coating-liquid outlet, adapted to move with respect to the substrate along a first axial direction and capable of coating the substrate with coating liquid through the coating-liquid outlet; and adjustment unit connected to the coating head and including a movable pad disposed proximal to the coating-liquid outlet and adapted to move along a second axial direction for adjusting the size of the opening of the coating-liquid outlet; and a drive assembly connected to the adjustment unit for controlling the adjustment unit to move along the second axial direction. Additionally a coating method is provided.

主权项

1. A substrate surface metallization method, comprising:
providing a silicon substrate having a surface; modifying the surface of the silicon substrate by using at least one silane compound; depositing a plurality of colloidal nanoparticle groups to the surface of the silicon substrate, wherein the colloidal nanoparticle groups each include at least one palladium nanoparticle capped with at least one polymer; and electroless plating the surface of the silicon substrate to form an electroless metallic layer on the surface of the silicon substrate.