| 摘要 |
The present invention relates to a substrate spinning apparatus, which supports and rotates a substrate having a rounded disk shape having a notch formed therein. The substrate spinning apparatus includes: a driving support having a rotary shaft perpendicularly installed in post form to be rotated, having a driving contact coupled to the front end portion of the rotary shaft, and contacting the edge of the substrate to be rotated, and configured to rotate the substrate; an idler support having a rotary shaft perpendicularly installed in post form to be rotated, having an idler contact coupled to the front end portion of the rotary shaft, and contacting the edge of the substrate to be rotated, and configured to engage with the substrate to be rotated; a vibration sensor installed in the idler support to sense vibration generated when the notch of the substrate contacts the idler contact; and a control unit sensing the number of rotations of the substrate based on the number of vibrations of the vibration sensor. When spinning a substrate, such as a wafer, having a recessed notch formed in the edge of the substrate, the substrate spinning apparatus can sense an impact in a horizontal direction thereof, generated by the notch when the notch passes through the idler support, with the vibration sensor, can count the number of rotations of the substrate, based on the number of times of impacts generated by the notch, which is sensed by the vibration sensor, to directly count the number of rotations of the substrate even when a slip between the substrate and the idler support caused by a washing solution or the like occurs, thus measuring the accurate number of rotations of the substrate. As a result, a treatment process can be performed consistently and reliably. |
