| 摘要 |
The present invention relates to a die bonding apparatus for a semiconductor chip which transfers and attaches a semiconductor chip to a lead frame or a substrate or the like. According to the present invention, the die bonding apparatus for a semiconductor chip is picking the semiconductor chip up in a chip carrier holding a plurality of semiconductor chips to transfer and attach to a target. The die bonding apparatus for a semiconductor chip comprises: a picker for picking up and transferring a semiconductor chip from a chip carrier; a first chip buffer where a semiconductor chip transferred by being picked up by the picker is laid down; a first pick up unit for picking up the semiconductor chip from the first buffer to transfer and attach to the target; and a control unit. The control unit controls the picker and the first pick up unit to sequentially transfer and attach the semiconductor chip which is sequentially transferred by the picker from the chip carrier to the first chip buffer by picking up the semiconductor chip by the first pick up unit. |
