RESIN SEALING TYPE ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a resin sealing type electronic component which achieves excellent environmental resistance, has a simple structure, and may be manufactured in a short time at low costs.SOLUTION: A resin sealing type electronic component includes: a chip-like electronic component body 2; a cylindrical member 3 housing the electronic component body; and a sealing material 4 which fills a space between the electronic component body and the cylindrical member to seal the electronic component body. The cylindrical member and the sealing material are formed by the same resin material. The sealing material is formed by injecting the resin material into the cylindrical member by injection molding in a state where the electronic component body is inserted into the cylindrical member. The cylindrical member has: an outer peripheral surface layer 3a exposed to an outer peripheral surface; an inner peripheral surface layer 3b exposed to an inner peripheral surface; and an internal layer 3c disposed between the outer peripheral surface layer and the inner peripheral surface layer. The internal layer and the sealing material are softer than the outer peripheral surface layer and the inner peripheral surface layer.SELECTED DRAWING: Figure 1