| 发明名称 | Method for manufacturing a composite compensating balance spring | ||
| 摘要 | A method for manufacturing a composite compensating balance spring is provided, the method including providing a first wafer made of a first material; providing at least one second wafer made of at least one second material having Young's modulus variations with temperature that are of opposite sign as those of the first material; joining the first wafer to the at least one second wafer to form a substrate; etching a pattern through the substrate to form a composite compensating balance spring including a first thickness of the first material and at least a second thickness of the at least one second material; and releasing the composite compensating balance spring from the substrate. | ||
| 申请公布号 | US9428382(B2) | 申请公布日期 | 2016.08.30 |
| 申请号 | US201514718492 | 申请日期 | 2015.05.21 |
| 申请人 | The Switch Group Research and Development Ltd. | 发明人 | Hessler Thierry |
| 分类号 | B81C1/00;G04B17/22;G04B17/06 | 主分类号 | B81C1/00 |
| 代理机构 | Oblon, McClelland, Maier & Neustadt, L.L.P. | 代理人 | Oblon, McClelland, Maier & Neustadt, L.L.P. |
| 主权项 | 1. A method for manufacturing a composite compensating balance spring, comprising: providing a first wafer made of a first material; providing at least one second wafer made of at least one second material having Young's modulus variations with temperature that are of opposite sign as those of the first material; joining the first wafer to the at least one second wafer to form a substrate; etching a pattern through the substrate to form a composite compensating balance spring including a first thickness of the first material and at least a second thickness of the at least one second material; and releasing the composite compensating balance spring from the substrate. | ||
| 地址 | Marin CH | ||