发明名称 PACKAGE FOR MICROWAVE CIRCUIT
摘要 PURPOSE:To increase a frequency band to be used by suppressing a cavity resonance by inserting an electromagnetic wave absorption material to a frame part of a package. CONSTITUTION:A cavity part 701 and a sheetlike electromagnetic wave absorption material 401 provided with a placing part of a lead 601 to become input/ output parts of a microwave signal are formed on a metal base 501. Then, the material 401 is coated with pastelike metal 201, and laminated in a necessary thickness to form a frame 101. Then, in order to maintain a potential of the metal in the frame constant, the surface of the frame is coated with pastelike metal, and simultaneously burned. Eventually, an insulator board 901 and a lead 601 formed with a microwave signal input/output signal line conductors 801 are mounted. When the package formed as above is used, distributions of an electric field and a magnetic field in the cavity are suppressed to eliminate a resonance.
申请公布号 JPH0653682(A) 申请公布日期 1994.02.25
申请号 JP19920205709 申请日期 1992.07.31
申请人 NIPPON TELEGR & TELEPH CORP <NTT> 发明人 IWASAKI NOBORU;KATSURA KOSUKE;KUKUTSU NAOYA
分类号 H01L23/12;H01P1/00;H01P1/212;H01P3/08;H05K9/00 主分类号 H01L23/12
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