| 摘要 |
<p>PURPOSE:To provide a noncontact IC card capable of performing the test of the functional unit of an electronic circuit in the inside of the card after the card is molded and to provide a method for testing and producing the noncontact IC card. CONSTITUTION:A wiring electric conductor 8 for test is equipped with both wiring patterns 15a for test which are connected to electronic parts 12 placed on a substrate 10 and test pads 11. The test pads 11 are exposed to the outside and sealed by resin. After a noncontact IC card is molded, test is performed at every one item in the electronic parts 12 by using the test pads 11. After the test is finished, the test pads 11 are insulated from the outside by using an insulation device 17. Thereby, since the test of the functional unit of an electronic circuit is performed after the card is molded, a defective pot is specified even for a defective generated at a time for molding the card.</p> |
