POLISHING DEVICE, POLISHING METHOD, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide polishing device and polishing method for realizing high flattening, and a manufacturing method for a semiconductor device by using the polishing method.

SOLUTION: This polishing device 4 has a polishing surface plate 8, polishing cloth 7 mounted on the polishing surface plate 8 to polish a wafer 17, a dresser 9 for dressing the surface of the polishing cloth 7 and an inclined angle measuring means 10 for measuring an inclined angle of the surface of the polishing cloth 7. The inclined angle measuring means 10 may have a film thickness measuring part 13 for measuring film thickness of the polishing cloth 7 and an inclined angle calculating part 14 for calculating the inclined angle from the film thickness. The film thickness measuring part 13 may have an eddy current sensor 15. It is desirable that a dressing condition control part 11 for controlling the condition of dressing according to the inclined angle is connected to the inclined angle measuring means 10 and the part 11 is a mechanism for transmitting control data to the dresser 9.

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