| 摘要 |
PURPOSE:To avoid an insertion miss of the lead of an electronic part into a wiring substrate for increasing the working efficiency. CONSTITUTION:This assembling device is provided with a chucking mechanism C holding an electronic part main body 26a and a lead correcting mechanism R. The chucking mechanism C shifting from the stand-by position to the lead insertion position for a wiring substrate 28 can insert a lead 27 into wiring substrate 28. The lead correcting mechanism R having a free opening and closing correction holding part can bring about the pre-correction state wherein the lead 27 is inserted in the state before the chucking mechanism C is shifted to the lead inserting position as well as the correction stage wherein the lead 27 is corrected to be held as it is. On the other hand, an interlocking means is provided between both mechanism C and R so that the lead correcting mechanism R and the chucking mechanism C may be shifted to the lead insertion position. After the lead 27 is corrected by the correction holding part, the chucking mechanism C is shifted to the lead insertion position while the lead correction mechanism R holding the correcting state is likewise shifted so that the lead 27 in the surely corrected state may be inserted into the wiring substrate 28. |
