发明名称 Geraet zum Aufbringen von Loetmittel oder aehnlichem schmelzbarem Material
摘要 <p>1,099,650. Soldering. RAYCHEM CORPORATION. May 10, 1966 [May 11, 1965], No. 20670/66. Heading B3R. An applicator for applying solder simultaneously to a plurality of terminal points of a printed circuit board 13 comprises a sheet 10 of plastics material provided with a series of heat-recoverable cup-shaped deformations 11, i.e. which on heating recover their original form, the cups 11 being located on the sheet 10 so as to register with the terminal points and each containing a preformed body 12 of solder and flux of exactly the requisite amount for soldering a terminal. To carry out soldering, the electrical components to be connected to the board are positioned beneath the board with their terminal pins 17 located in the holes 15 therein, the applicator sheet is placed over the board and held thereon with the cups registering with the holes and heat is applied e.g. by a convector appliance (18), (Fig. 2, not shown). When the solder melts, the cups return to their original flat condition in the sheet and the solder is thereby pressed out of the cups into the terminal holes. Suitable plastics materials are crosslinked polymers and preferably an irradiated thermally stabilized polyolefin which is both easily formed and transparent.</p>
申请公布号 DE1552962(A1) 申请公布日期 1970.04.16
申请号 DE19661552962 申请日期 1966.05.07
申请人 RAYCHEM CORP. 发明人 HEWITT ELLIS,ROGER
分类号 B23K3/06;B29C31/06;B29C53/18;B29C65/02;H05K3/34 主分类号 B23K3/06
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