| 摘要 |
<p>This invention relates to a semiconductor lead attachment system which is particularly useful in the automatic application of external leads to contact areas formed on pellets or dice of semiconductor material. These pellets, prior to subdivision of the pellets from the parent wafer which they constitute, are precisely engaged with and located on a pellet orientation plate. This is accomplished by attaching the parent wafer to the top surface of the orientation plate with a thermally releasable adhesive layer and subdividing the parent wafer with a plurality of grooves into individual pellets while at the same time forming a network of pedestal-shaped supports in the orientation plate which are thermally isolated from each other. Each individual pellet is then selectively released and removed from the orientation plate during the course of heating each pellet while the leads are being bonded thereto.</p> |
