| 摘要 |
1300881 Semi-conductor devices SIEMENS AG 10 May 1971 [11 May 1970] 13988/71 Heading H1K A stacked arrangement of semi-conductor bodies, placed one upon another, has connecting leads at right angles to the major surfaces of the bodies. In one embodiment the connecting leads may be formed from two metallic frames 12, 13 associated with each body 1, the frame 12 including cross-pieces 2 which make contact to contact areas 5 on the body. The frame 13 is positioned on frame 12, and also has crosspieces 3 which correspond to, but are shorter than, crosspieces 2. Such frames and bodies may be stacked as shown, Fig. 2, the frames being soldered together, and an insulating resin 8 being injected between the bodies, prior to severing the crosspieces 2 and 3 from the frames along line 10. When severed the crosspieces have no lateral connections but retain vertical connections between bodies, rendering the arrangement, when the bodies are integrated circuits, suitable for data memory stores. In an alternative embodiment, vertical connections are made by means of conducting pins which penetrate bores in the contacts 5 and the part of the body therebelow. |
