| 摘要 |
1364530 Semi-conductor devices BBC BROWN BOVERI & CO Ltd 4 Aug 1971 [10 Aug 1970] 36721/71 Heading H1K A method of forming a rectifier comprises dividing axially a stack of diode elements, soldered electrically in series with a soft solder, to produce a plurality of stacks, providing one of the stacks with terminals, etching the stack so as to produce a throat 9 in each element, and providing the stack with a protective varnish. The diodes may be of silicon, the solder being of lead-silver or an alloy of Pb-Sn-Ag; Pb-Sn-Cu; Pb-Ag-In or Pb-Ag-Cu. The throat 9 is said to reduce the surface field strength of each element. The division of the stock may be accomplished using a reciprocating frame saw, wire frame saw, rotary diamond frame saw or an ultrasonic drill. The rectifier may be assembled in a housing or have insulating material pressed around it. |
