| 摘要 |
<P>PROBLEM TO BE SOLVED: To efficiently discharge heat generated when a semiconductor light emitting device chip emits light to outside of the light emitting device. <P>SOLUTION: The light emitting device comprises a GaN-based first semiconductor blue light emitting device chip 1110, a GaN-based second semiconductor green light emitting device chip 1120, a third semiconductor red light emitting device chip 1130, a first lead member 1210 having a mounting part 1210b for mounting the first semiconductor light emitting device chip 1110 and a metallic part 1210d for radiating heat from the first semiconductor light emitting device chip 1110, a third lead member 1230 having a mounting part 1230b for mounting the second semiconductor light emitting device chip 1120 and a metallic part 1230d for radiating heat from the second semiconductor light emitting device chip 1120, a fifth lead member 1250 for mounting the third semiconductor light emitting device chip 1130, and a molding member 1300 for fixing the lead members. <P>COPYRIGHT: (C)2007,JPO&INPIT |
