| 摘要 |
A method for mounting socket contacts to the leads of electronic component packages having a dual-in-line configuration, and for one-step mounting of the pre-socketed packages to dual-in-line arrays of holes in a panel board. Dual-in-line packages (DIP) are fed to a processor where a plurality of socket contacts are separated into two parallel spaced rows and the leads of the DIP are inserted into the sockets. The thus pre-socketed DIP's are repackaged for further handling, to ultimately be assembled to a panel board wherein dual-in-line arrays of holes have been drilled. The ends of the socket contacts projecting from the back side of the board are normally wave soldered for permanent electrical connection, while the IC remains in position secured to the board by means of the socket contacts. |
