Source-earth connection formation for MESFET chips - uses substrate with contacts each projecting beyond corresponding chip to provide contact edge

摘要

The connections for several MOSFET chips (11) are formed simultaneously by using a common substrate (1) divided into parallel sections (12,13) in which the individual chips (11) are placed. Each section (12,13) has a surface contact (4) for the chip (11) which projects (4) for the chip (11) which projects beyond the edge of the latter at one side, to provide a contact edge which the contact edge projects. Pref. the surface of the substrate (1) with the applied chip contacts (4,5,6) is coated with a protective lacquer.