| 摘要 |
PURPOSE:To make it possible to polish the surface of a sample with the surface of a place to be observed being visually confirmed by using a material, which can be removed by the treatment with chemical, covering the place, where the shape of the cross-section of the sample is observed, embedding the sample in a resin, and removing the part using a chemical. CONSTITUTION:A silver paste 3 is applied on the surface of a semiconductor chip 1 including a place 1a to be observed and its vicinity so that the paste is piled up. Then, the semiconductor chip 1, on which the silver paste 3 is applied, is embedded in a resin 2. Thereafter the silver paste 3 is removed using an organic solvent. Thus a cavity, through which the place 1a to be observed and its vicinity can be observed, is obtained. With the surface of the semiconductor chip 1 in the cavity being confirmed, polishing is performed from the front edge face. Thus, the polishing of the cross-section can be carried out with the surface of the sample being confirmed. The polishing of the cross- section becomes easy, and working efficiency is improved. |
