| 摘要 |
PURPOSE:To chuck a semiconductor wafer positively under vacuum without damaging and staining the surface of the wafer by applying a liquefied rubber to the element forming surface of the wafer and forming a protective film. CONSTITUTION:A normal-temperature curing liquefied rubber agent is applied to the element forming surface of the semiconductor wafer 3, and cured to form the protective film 6. A surface protected by the protective film 6 of the wafer 3 is sucked and fixed to a chucking table 7, and the back of the wafer is ground by a grinding head 8. Accordingly, since the surface of the wafer is sucked to the chucking table 7 through the protective film, the surface is not damaged, silicon chips generated during grinding are also in contact with the surface directly, and the surface is not stained.
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