| 摘要 |
An electrically insulating substrate has an array of holes formed in it for accepting electrically conducting support pins, each pin having a light-emitting element mounted on the upper pin end. Each upper pin end is surrounded by an insulating ring and a conducting ring, the light emitting element being connected electrically between the conducting pin and the conducting ring. Electrical connections are made via a printed wiring pattern on each surface of the substrate. Optical collimating elements are formed in a wafer having openings that surround each of the conducting rings with a small clearance, the wafer engaging and being insulated from the substrate with the printed wiring. |
