| 摘要 |
<p>PURPOSE:To ensure bonding by a method wherein heating is stopped after a low-temperature part having a largest lag of a temperature increase in a bonding interface is heated to at least a lower limit temperature of a bonding possible temperature range, and a pressure is reduced to an ordinary pressure after a high-temperature part having a largest lag of a temperature decrease is cooled to at most an upper limit temperature of the bonding possible temperature range. CONSTITUTION:A rubber is bonded to an ultra-high-molecular-weight polyethylene having a weight-average molecular weight of 500000 or more by a particle size method under heat and pressure. At the time of bonding, a low-temperature part having a largest lag of a temperature increase in a bonding interface in heating in a pressurized state is heated to at least a lower limit temperature of a bonding possible temperature range, and heating is stopped. A pressure is reduced to an ordinary pressure after a high-temperature part having a largest lag of a temperature decrease in the bonding interface is cooled to at most an upper limit temperature of the bonding possible temperature range. As the rubber, a non-polar polymer, such as a natural rubber or a styrene-butadiene rubber, or an unvulcanized rubber is used In the use of a vulcanized rubber, a rubber surface is roughened. It is preferable that a pressurizing force is 10-30kgf/cm<2> and the bonding possible temperature range is from a lower limit temperature of 145 deg.C to an upper limit temperature of 155 deg.C.</p> |
