| 摘要 |
PURPOSE:To improve the adhesiveness of a thin Ag film layer and Ni plating layer by forming the thin Ni-based film prior to the Ni plating in a method for coating a photoresist on a glass master disk, forming a conduction-affording film of Ag thereon after exposing and developing and subjecting the film to the Ni plating. CONSTITUTION:The photoresist 2 is coated over the entire surface of the glass master disk 1 and is prebaked. The resist is then exposed with a laser cutting machine and after a laser is projected to the part where pits and grooves are formed, the resist is developed and post-baked. The thin Ag film layer 3 is formed by a sputtering device over the entire front surface of the master disk 1 and in succession thereof, the thin Ni or Ni alloy film layer 4 is formed thereon to form the conduction-affording film. The thickness of the thin Ni-based film layer is required to be about >=50Angstrom in order to obtain the effect of preventing the discoloration of Ag is confined to about <=100Angstrom as the internal stress increases with an increase in the thickness and the depth of the pits and grooves decreases. An electrocast Ni layer 5 is finally electroformed to a desired thickness thereon and after the rear surface thereof is polished, the layer 5 is stripped from the master disk 1 and the photoresist 2 is stripped, then the layer 3 is stripped.
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