发明名称 Stackable semiconductor components
摘要 The invention relates to semiconductor components, especially bipolar transistors and diodes, which are arranged one above another. The component layers and the corresponding contact layers are produced in an epitaxial method. Contact with the component layers is achieved via metal semiconductor layers, which are grown epitaxially between the component layers, and via polycrystalline semiconductor layers bordering on the component layer at the sides.
申请公布号 DE3743774(A1) 申请公布日期 1989.07.13
申请号 DE19873743774 申请日期 1987.12.23
申请人 LICENTIA PATENT-VERWALTUNGS-GMBH 发明人 KOENIG,ULF,DR.-ING.;KUISL,MAX,DR.RER.NAT.;SASSE,HANS-ECKARD,DR.RER.NAT.
分类号 H01L21/822;H01L25/07;H01L27/06 主分类号 H01L21/822
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