| 摘要 |
PURPOSE:To enhance a component in lead bonding reliability when the component provided with leads is mounted on a board by a method wherein a jig which sucks up molten solder through a capillary phenomenon is provided on both the side where the components are mounted and the other side of the board. CONSTITUTION:A connector 2 is aligned so as to enable its leads 3 to be inserted into flux applied through-holes 1a bored in a board 1 at prescribed positions. On the other hand, a solid solder ring 6 is inserted so as to sandwich the board 1 with the connector 2, and a jig 5 which is formed of resin and provided with holes 5a at positions corresponding to the through-holes 1a is placed on the solder rings 6 enabling the leads 3 to be inserted into the holes 5a, where the inner walls of the holes 5a are rough. In this state, when a reflow process is carried out, solder comes into contact with the rough wall faces of the holes 5a and is sucked up toward the jig 5 to form solder fillets 4. |
