| 摘要 |
PURPOSE:To manufacture a stamper having a fine uneven pattern, the depths of grooves of which are free from dispersion. CONSTITUTION:Film making of an Au layer is performed on an SiO2 base. Film making of a Ti layer is performed on the Au layer. A resist pattern is formed on the Ti layer. Etching mask of the resist pattern is performed, wet etching of only the Ti layer is performed up to the surface of the Au layer and a pattern is formed. After removal of the resist pattern, an Ni electroformed layer where the pattern of the Ti layer is reversed by electroforming Ni is formed on the surface of the Ti layer. The SiO2 base is separated from the Au layer and the Au layer is removed by melting the same. Then the Ti layer is removed from the Ni electroformed layer by melting the Ti layer and a stamper comprised of the Ni is obtained. With this construction, a depth of the pattern to be formed on the Ti layer is decided by a film thickness of the Ti layer. Since the film making of the Ti layer can be performed at a uniform film thickness, dispersion is not generated in depths of grooves of a fine uneven pattern of a stamper to be formed by reversing the pattern. |
