| 摘要 |
PURPOSE:To raise the heat dissipating efficiency by a method wherein the area of a heat dissipating fin is made wider than that of a cap covering a semiconductor chip and bonded onto the rear surface of the same. CONSTITUTION:A semiconductor chip 4 is connected facedown to the main surface of a package substrate 2 comprising a wiring substrate through the intermediary of solder bumps 3. On the other hand, the main surface of the package substrate 2 is sealed with a cap 6 covering the semiconductor chip 4 through the intermediary of a sealing solder 5. Next, a heat dissipating fin 7 is fixed on the cap 6 furthermore leads 8 as outer terminals are fixed to the main surface of the package substrate 2. At this time, the flat main body 12 of the semiconductor chip 4 is formed wider than the other cap 6 part in the same size as that of the heat dissipating fin 7. In such a constitution, the heat dissipating efficiency can be raised thereby enabling the title electronic device to be made applicable to a cooling system in a simple mechanism. |
