发明名称 ELECTRONIC COMPONENT STRUCTURE
摘要 PURPOSE:To enable a part of low melting point alloy layer to creep up on the surface of outer part in excellent wettability by a method wherein a part of low melting point alloy reaches the surface of the outer lead part through one or a plurality of pores bored through the outer lead part. CONSTITUTION:When a press down piece 10 is lowered, one of the outer lead part 8 is pressed down. Next, the outer lead part 8 is irradiated with a converged laser beam from a projector to heat a low melting point layer 5. Thus, a part of the fused low melting point alloy layer 5 passing along the side of the outer lead part 8 creeps up on the surface of the outer lead part 8. On the other hand, the pores 9 suck up a part of the fused low melting point alloy 5 to be lifted by the capillary phenomenon. Accordingly, the lifted melting point alloy can be spread in excellent wettability on the surface of the outer lead parts 8.
申请公布号 JPH06252324(A) 申请公布日期 1994.09.09
申请号 JP19930033557 申请日期 1993.02.23
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 TSUKAHARA NORITO;NISHIDA KAZUTO;KITAYAMA YOSHIFUMI
分类号 H01G4/228;H01L23/50;H01R4/02;H05K3/34;(IPC1-7):H01L23/50;H01G1/14 主分类号 H01G4/228
代理机构 代理人
主权项
地址