| 摘要 |
PURPOSE:To obtain sufficient soldering strength by providing a thermoplastic resin at a specified thickness between the part attaching wiring conductor of a surface layer and fiber fabric closest to the conductor. CONSTITUTION:The core material of fiber fabric 3 is impregnated with a thermoplastic resin 2 in a composite fiber-fabric resin film. A wiring conductor 4 is arranged on at least one surface of the resin film in a wiring board. A plurality of the wiring boards are laminated, heated and compressed, and a multilayered wiring board 11 is formed as a unitary body. The thermoplastic resin 2 is provided at a specified thickness 5 between the part attaching wiring conductor 4 at the surface layer part and the fiber fabric 3 closest to the conductor 4. The specified thickness 5 is 10mum or more, when polyphenylene sulfide resin, polyether ether ketone resin, polyamide resin or any one kind of the composite materials of these resin is used, and 6mum or more when thermoplastic polyimide resin, liquid crystal polymer resin or any one kind of the composite materials of these resin is used. |
