| 摘要 |
PURPOSE:To provide a multilayer FPC wiring board of high reliability having no interlayer slippage and reducing cost. CONSTITUTION:A polyimide resin is used as a material for a base substrate film 4 and an adhesive sheet 5. On both sides of a flexible cable 2, the base substrate film 4 having no conductive pattern 3 on the outside is provided, and this base substrate film 4 serves as a protective layer for the conductive pattern 3 formed inside the film. |
