发明名称 HEAT TREATMENT BOAT FOR SEMICONDUCTOR WAFER
摘要 <p>PURPOSE:To prevent particles from ahering to a semiconductor wafer by making smooth a gas flow in a furnace tube. CONSTITUTION:A boat 2 includes a front part 10 and a rear part 12, both streamlined in a furnace tube 20. It further includes a central portion slits for receiving semiconductor wafers 1 in such a manner that they are perpendicular to the flow of gas. It furthermore includes a lower portion for which a leg 14 is provided such that the boat is insertable into the oven core pipe 20. Thus, the front part and the rear part make smooth the gas flow in the tube to prevent particles from adhering thereto owing to wind-up. Additionally, a plurality of semiconductor wafers can be treated simultaneously, and they can be easily taken out, so that maintenance such as cleaning is facilitated.</p>
申请公布号 JPH07130670(A) 申请公布日期 1995.05.19
申请号 JP19930300897 申请日期 1993.11.05
申请人 NEC CORP 发明人 MASUDA SHUICHI
分类号 B08B17/02;F26B25/18;H01L21/22;H01L21/324;H01L21/673;H01L21/68;(IPC1-7):H01L21/22 主分类号 B08B17/02
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