MANUFACTURE OF CHIP SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device to reduce generation of product defects and to improve production efficiency at the time of manufacturing a plurality of semiconductor devices from a substrate. SOLUTION: In this method, manufacturing of a semiconductor device includes such a process wherein semiconductor chips mounted on one side of lead terminals 4 and those mounted on the other side of the lead terminals 4 are electrically connected by wire bonding in the substrate 1 where a pair of terminals 4 (4a, 4b) are formed at an almost equal pitch along the go direction. A pair of above-mentioned holding bodies hold down both end parts in the row direction of the substrate 1 excluding the above-mentioned semiconductor chips and the regions to be wire-bonded in a state at least two row pitch portions of the lead terminals 4 are separated.