| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve coverage due to an insulating film by forming a satisfactory tapered surface and to improve corrosion resistance. SOLUTION: This board 2 is provided with 1st electrode wiring 4 formed on a substrate 3 and an insulating film 5 formed on the 1st electrode wiring 4 at least. In this case, the 1st electrode wiring 4 is provided with the 1st conductive thin film of film thickness less than 500Åand a 2nd conductive thin film, which is arranged on the 1st conductive thin film, is composed of the same materials as the 1st conductive thin film and has film thickness less than 500Å, at least.</p> |
