| 摘要 |
<p>PROBLEM TO BE SOLVED: To enable confirming spread of conducting adhesive agent, and restrain unnecessary spread, by forming an upper stage part as a semiconductor chip mounting surface and a lower stage part wherein stepped part is formed in the peripheral part of the mounting surface. SOLUTION: The die pad part of a lead frame has an upper stage part 6 as the mounting surface of a semiconductor chip 1 and a lower stage part wherein the stepped part is formed in the peripheral part of the mounting surface. A linear uneven part 5 is almost concentrically formed from the center of the die pad part in the lower stage part of the die pad 3. By this constructure in a die bonding process, a gap is formed between the lower surface part 4 of the semiconductor chip 1 and the upper stage part 6 of the die pad. Through this gap, spread of conducting adhesive agent 2 can be visually confirmed. By the effect of configuration having the uneven part 5 formed in the lower stage part of the die pad, unnecessary spread of the conducting adhesive agent 2 in the lower stage part of the die pad can be restrained when the setting amount of the conducting adhesive agent 2 is large.</p> |
