| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent the chipping, cracking, etc., of an insulating substrate even when a wiring board violently comes into collision with another wiring board or part of a semiconductor device. SOLUTION: When a wiring board is constituted by forming wiring conductors 2 formed by coupling metallic particles with a thermosetting resin on an insulating substrate 1 formed by coupling 60-95wt.% inorganic insulator powder with 5-40wt.% thermosetting resin, the surfaces of the metallic particles in the conductors 2 are coated with a silane coupling agent. When the surfaces of the metallic particles are coated with the coupling agent, the coupling between the metallic particles and thermosetting resin in the conductors 2 become extremely strong and part of the conductors 2 is not separated from the conductors nor peeled off from the substrate 1.</p> |
