发明名称 RESIN-SEALED HYBRID INTEGRATED CIRCUIT
摘要 <p>PROBLEM TO BE SOLVED: To provide a resin-sealed hybrid integrated circuit which can accurately adjust the resistance value of a resistor by a trimming method without any restrictions of working environment under an assembled condition after major circuit devices in the circuit are sealed with resin. SOLUTION: In the resin-sealed hybrid integrated circuit wherein circuit devices such as a semiconductor chip 7 and an IC chip 8 are mounted on a lead frame 9 and then molded with resin therearound; a film resistor 4 for setting of a circuit constant, whose resistance value is to be adjusted by a trimming method, is provided outside sealed resin 11 and externally mounted to the lead frame. The trimming work of the resistor is conducted by passing a current through the circuit under the assembled condition after the resin-sealed and under the same conditions as when the product is actually used.</p>
申请公布号 JPH10163412(A) 申请公布日期 1998.06.19
申请号 JP19960321446 申请日期 1996.12.02
申请人 FUJI ELECTRIC CO LTD 发明人 AKANUMA YOSHIYA
分类号 H01L23/28;H01L23/50;H01L23/58;H01L25/04;H01L25/18;(IPC1-7):H01L23/58 主分类号 H01L23/28
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