发明名称 METHOD AND DEVICE FOR MOUNTING ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide an electronic component mounting method to improve productivity by simply constituting a temporary component placing mechanism for chucking a plurality of electronic components the same time with a plurality of chuck nozzles, provided on a suction head to effectively supply and transfer the components. SOLUTION: After a desired number of electronic components 2 are mounted according to a mounting sequence on a temporarily placing means 8 disposed on an draw-out arm 7, a tray 3 is returned to a tray-exchanging position and is disengaged by the draw-out arm 7 and then the draw-out arm 7 is moved solely to a part supply line. While the plurality of electronic components 2 transferred to the temporarily placing means 8 are chucked by the chuck nozzles of a suction head, the tray 3 receiving the desired electronic part 2 is positioned at the tray-exchanging position.
申请公布号 JPH10341097(A) 申请公布日期 1998.12.22
申请号 JP19970148963 申请日期 1997.06.06
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 KITAMURA NAOYUKI;OKUDA OSAMU;TAKEDA TAKESHI;KABESHITA AKIRA
分类号 B23P19/00;H05K13/02 主分类号 B23P19/00
代理机构 代理人
主权项
地址