Separation arrangement e.g. for micro components such as separating microchips from adhesive carrier

摘要

The arrangement has a housing body (2) whose end surface forms the contact surface for the carrier, a separation region (19), an adjacent device for fixing the adhesive carrier (30) during separation of a micro component (20') and at least one restraining device. The separation region has a recess (4') and a supporting element (10,10') with a separation edge (16). At least one suction channel (7) opens into the recess next to the separating edge.