| 摘要 |
PROBLEM TO BE SOLVED: To shorten the transfer course of a substrate and transfer the substrate in a short time by freely movably arranging a perpendicularly stretched transfer course, and installing a transferring mechanism which carries in/out the substrate to and from a treating mechanism which constitutes a first and a second treating parts. SOLUTION: A semiconductor wafer before treatment in a carrier mounted on a loader part 1 is carried out by holding the wafer with an arm installed on a transfer course 7, and carried in and mounted on an alignment stage part 6. The semiconductor wafer mounted on the alignment stage part 6 is carried in and mounted on a coating mechanism 8 and a prebaking mechanism 9, as a first treating part, by a wafer transferring mechanism 12, in which a perpendicularly stretched transfer path is movably arranged, and subjected to a specified treatment. After the treatment is finished, the semiconductor wafer is carried in and mounted on a developing mechanism 10 and a postbaking mechanism 11, as a second treating part which is arranged at a position different from the mechanism 8, 9 by the wafer transferring mechanism 12, and is subjected to a series of treatments. |
