| 摘要 |
PROBLEM TO BE SOLVED: To reduce the space of each via hole in the most outer layer and thereby increase the density of via holes by using through hole lands of a shield board as pads for connecting the via holes which are formed on the surfaces of the most outer layers have a circular shape concentrical with a through hole and have a taper angle. SOLUTION: This shield board of two or more layers has through hole lands 14, 15, 16, 17, a conduction connection hole 12, inner layer conductors 4, 5, hole filling insulating resin 9 and the like. On the front and the rear face of the shield board, an epoxy resin-made interlayer adhesive 19A, 19B is applied for multilayer bonding. The through hole lands 14, 15, 16, 17 are used as pads for connecting via holes 31, 32 on the surfaces of the most outer layers, and via holes 31, 32 having a taper angle of 9-19 deg. and a circular shape concentrical with the conduction connection hole 12 are formed. By this method, a thin-type multilayer printed wiring board which is suitable for reduction in thickness and high-density mounting and has an excellent connection reliability can be manufactured. |
