| 摘要 |
PURPOSE: A labeling method of a wafer removes a time loss of various cases occurred in a labeling process, and reduces a time of process for marking a lot number on a wafer. CONSTITUTION: In a photoresist process of a semiconductor, a labeling method deposits(100)a photoresist on a wafer, attaches a labeling part to a lateral part of a reduced projection lens, a light-exposing process of a photoresist and a labeling process are performed at the same time, a developing liquid of a photoresist is jetted(120) on the photoresist. Then, a pattern test is performed(130). If the pattern is normally formed, the photoresist process is terminated(140). Thereby, the labeling method removes a time loss of various cases occurred in a labeling process, and reduces a time of process for marking a lot number on a wafer.
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