| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board for improving practicality, for reducing environmental problems, and for transmitting electrical signals, especially a high-speed signal, without degrading it by omitting joint integrated constitution with adhesive. SOLUTION: This wiring board is provided with a wiring board body constituted of an insulator layer 1, made of liquid crystal polymer at least on whose one main face wiring patterns 2a and 2b are formed, photo-solder layers 3a and 3b integrally coated by selectively exposing parts to be connected on the faces of the wiring patterns 2a and 2b, and a cover lay film layer 4 directly arranged on one main face side of the wiring board body and integrally arranged via the photo-solder layer 3b. Also, the wiring board body can be a multilayer wiring pattern type, and inter-wiring pattern layer connection may be a conductive bump inserted through the insulator layer. |
