| 摘要 |
PROBLEM TO BE SOLVED: To efficiently dissipate heat from a semiconductor element by making short the transfer path from the semiconductor element to a water-cooling heat sink, without damaging the ceramic substrate. SOLUTION: A power-modulating substrate is provided with a ceramic substrate 11, where a plurality of insulating holes 11a are formed, a metal member 11 having a thickness the same as or slightly smaller than that of the ceramic substrate, which is inserted in the insertion hole, first through-holes 13a which are adhered to the surface of the ceramic substrate and the metal member via solder material 16 and communicated to the through-holes. Also, a first metal thin plate 13, where a circuit pattern 17 is formed on the part facing to the ceramic substrate and the second through holes 14a which are adhered to the backside and communicated to the through-holes and the first through- holes, are provided on this semiconductor substrate, a semiconductor element is mounted on the circuit pattern, and a power-modulating substrate 21 is connected directly to a water-cooling heat sink with a male screw. |
