| 摘要 |
PROBLEM TO BE SOLVED: To provide a method capable of manufacturing a printed wiring board of high reliability wherein higher density packaging is enabled with high yield, by using a simple process. SOLUTION: This manufacturing method is composed of a process wherein selective maskings 2a, 2b are performed to one surface of a conductive metal foil 1, and a protruding wiring pattern 1a is formed by half etching; a process wherein the masking layer 2a on the surface of the wiring pattern 1a formed in a protruding shape is eliminated, the surface of the wiring pattern 1a is made to face the main surface of an insulating resin layer 3, and lamination and arrangement are performed; a process wherein the laminated member is pressed, the protruding wiring pattern 1a is buried in the insulating resin layer 3, and these are collectively formed in an unified body; and a process wherein the conductive metal foil 1 is eliminated by etching, leaving a wiring pattern 1a' which is buried in the insulating member layer 3, and the wiring pattern 1a' is exposed on the surface of the insulating resin layer 3.
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