| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat sink and method for radiating heat from a plug-in type device by which the heat generated from a heat generating element mounted on the printed board of a card which can be inserted into and pulled out of an enclosure fixed on a rack, etc., can be radiated easily and efficiently to the outside of the enclosure and, in addition, can prevent malfunctions caused by static electricity and does not deteriorate the EMC characteristic. SOLUTION: The heat sink radiates the heat generated from a plug-in type device provided with at least one card which can be inserted into and pulled out from the enclosure and has the printed board 1, a front panel 2 installed to one end section of the board 1, and a connector 7 for backboard installed to the other end section of the board 1. The heat sink is provided with a micro heat pipe 8 one end of which is thermally connected to the heat generating element 6 provided on the printed board 1, and the other end of which is thermally connected to the front panel 2 through a prescribed route and transfers the heat from the heat generating element 6 to a prescribed portion of the front panel 2.
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