| 摘要 |
PROBLEM TO BE SOLVED: To provide a power circuit wherein an overvoltage protection is not required by suppressing parasitic reactance components and reliability is improved by improving a thermal resistance cycle. SOLUTION: Bus lines 50, 51, 52, 53, 54 of a power circuit wiring consists of a plurality of stacked flat conductors. A semiconductor device comprising a flat chip is sandwiched by a flat electric semiconductor device junction 58 and is bonded using a high heat and electric conductive adhesive 67 consisting of metal fillers and a resin, and the semiconductor device junction 58 is brought into contact with the bus lines 50, 51, 52, 53, 54 using the stacked wiring 57 of the flat conductors. |
