PRINTED WIRING BOARD, AND INSULATING RESIN COMPOSITION THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide an insulating resin composition for printed wiring boards wherein its working speed by a UV laser is fast and a good via can be formed in it. SOLUTION: The insulating resin composition for printed wiring boards contains a heat-resistant thermosetting resin (A) and an ultraviolet-ray absorbent (B), and the melting point of the ultraviolet-ray absorbent (B) is not lower than 120 deg.C. Also, the printed wiring board is obtained by heating and hardening at a temperature not lower than 150 deg.C the insulating resin composition for printed wiring boards.